Microsoft Integrates Marvell NIST FIPS 140-3 Level-3 Compliant LiquidSecurity HSMs into Azure Key Vault and Managed HSM Services
Marvell LiquidSecurity 1 and LiquidSecurity 2 hardware security modules (HSMs) achieved FIPS 140-3 Level-3 certification from the
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FIPS 140 (Federal Information Processing Standard) is a set of security requirements established by NIST (
FIPS 140-3 introduces several new security enhancements over FIPS 140-2. This new NIST FIPS 140-3 certification will eventually replace FIPS 140-2 certification as the latter will be moved to Historical List by
Transforming Encryption Through Optimized Processors
LiquidSecurity devices were created to eliminate the friction associated with achieving better security. A critical element of global commerce, HSMs perform the authentication and encryption processes behind secure key protection and management, credit card purchases, ATM withdrawals, sign-in services and other high-volume transactions. HSMs have historically been packaged as 1U and 2U server appliances running standard microprocessors. These appliances are managed directly by HSM users and deployed on their premises.
LiquidSecurity HSMs, by contrast, are PCIe-based devices powered by OCTEON® DPUs and designed for use in dense multi-tenant cloud environments. Six of the ten largest cloud service providers use LiquidSecurity in their operations. A single LiquidSecurity2 card can manage 100,000 pairs of encryption keys and process more than one million operations per second. As a result, cloud service providers can deliver HSM services while consuming a fraction of the power, rack space and hardware required by traditional HSMs. Meanwhile, HSM users can switch from the complexity of managing hardware to the ease of subscribing to HSM services. The cloud-based model for HSMs also reduces barriers to employing HSM and encryption services for secure medical records and other transactions.
Revenue from cloud-based HSMs is expected to grow from under 15% today to over 40% by 2028, according to
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About
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.
This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the "Risk Factors" section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the
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