Axcelis to Showcase Advanced Ion Implant Solutions at SEMICON Japan 2025
Visitors will experience Axcelis' next-generation ion implant technologies designed to boost device performance, enhance productivity, and reduce cost of ownership. Featured systems include:
- Purion Power Series+™ – Optimized for next-generation power devices, including emerging superjunction architectures. The new platform spans the full ion implant market with new extensions including Purion H200+ SiC for high current medium energy, Purion M+ SiC for medium current, and Purion XE+ SiC and Purion EXE+ SiC for high energy applications.
- Purion H™ Series – Delivers unmatched purity and precision with industry-leading productivity across the high current operating space. Features innovative scanned spot beam technology with precise implant angle and dose control to enhance device performance and yield.
- Purion XE™ Series - The industry leading high energy implant platform with the widest energy range, including the Purion XEmax model featuring our patented Boost Technology™ for the most advanced image sensor applications up to 15MeV.
- GSD Ovation™ ES – Provides best-in-class high current hydrogen and helium implant capability for engineered substrates, including wafer splitting. The new system is an evolution of the GSD Ovation Series platform, the industry benchmark for batch implanter productivity.
Special events on
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Innovative Ion Implant Solutions for Next Generation Power Devices
TechSPOT, Hall 5 | 15:30–15:50
Introducing the Purion Power Series+, the next generation of ion implant solutions designed to meet evolving performance & production demands for power devices, including superjunction architectures. New solutions enable lower CoO, increase process flexibility and tighten process control. -
Axcelis Happy Hour Celebration
Hall 2, Booth #2655 | 16:00–17:00
Join us for beverages and appetizers and meet theAxcelis team!
President and CEO of Axcelis Technologies Dr
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