Integration of recently launched Valens chipsets into cutting-edge machine vision products from Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, Leopard Imaging, and other companies, marks Valens' initial penetration into a $460 million Total Addressable Market
HOD HASHARON, Israel
, Oct. 1, 2024 /PRNewswire/ -- Today, Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, announced that it will showcase its innovative chipsets for the industrial machine vision market, thanks to the exceptional EMC performance and native CSI-2 extension support of the MIPI A-PHY-compliant VA7000, as well as the USB 3.2 extension capabilities of the VS6320.
Based on a variety of market research, the machine vision market is set to reach $7.8B by 2029, fueled by growth in factory and warehouse automation and tighter inspection regulations. MIPI A-PHY is a strong fit for this market due to the ability of the technology to be integrated inside the sensor, leading to smaller, more powerful, less expensive cameras. Valens estimates that its Total Addressable Market (TAM) in this segment is expected to reach $460 million by 2029.
"Machine vision is rising across a number of industries, and Valens is well positioned to capture a significant market share with two of our most innovative chips – the VA7000 and the VS6320," said Gabi Shriki, SVP, Head of Audio-Video Business at Valens Semiconductor. "We look forward to seeing our chipsets enabling advanced machine vision solutions through our growing partnerships in this industry."
Both the VS6320 and VA7000 provide significant value for vision applications in the industrial market. Designed initially for automotive, the VA7000 chipset is the first to comply with the MIPI A-PHY standard for high-performance sensor connectivity. A-PHY's unique design provides automotive-grade, high-performance connectivity and enables customers to reduce the power, size, and cost of cameras – which are all essential for machine vision applications. The VS6320 is the first ASIC-based USB 3.2 high performance extension solution on the market. Using the VS6320 chipset removes the key limitation of USB-based industrial cameras – their short link distance – while maintaining all of their advantages.
Valens has engaged with leading camera module manufacturers in industrial machine vision, and its chipsets are powering cutting-edge products by Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, Leopard Imaging, and other companies.
Teledyne e2v supports MIPI A-PHY for its Optimom™ range of turnkey imaging modules. This option paves the way for their use in specific MIPI applications where the vision processing unit is some distance away from the module.
"Our Optimom modules are widely used across multiple industries, and the latest Optimom™ 5D is a groundbreaking solution that offers both 2D and 3D vision simultaneously," said François Trolez, Marketing Manager, at Teledyne e2v. "Valens is providing a state-of-the-art long-distance MIPI connection, using simple, unshielded cabling. We included A-PHY as an option because of its flawless EMC performance, as well as its recognition as an industry standard. This will ensure the reliability of the vision data, offering an exciting proposition for our robotic and AMR focused customers and partners."
The new Optimom 5D module features Teledyne e2v's Topaz5D™ image sensor and offers both 2D vision and 3D depth data outputs. This unique 5D technology is enabled by IPs and software from Airy3D.
"Airy3D's DepthIQ single-sensor IP enables machine-vision applications to be realised where traditional short-range stereo and time of flight products fall short," said Ron Low, Sr VP Business Development and Marketing. "Partnering with both Teledyne e2v and Valens Semiconductor, our combined solutions allow for challenges such as occlusions, changing light conditions and long reach latency to be overcome which is an exciting development for the machine-vision industry going forwards."
FRAMOS, the leading global expert in embedded vision systems, has added A-PHY sensor module support to its popular FSM and FSM:GO ecosystem of optical image sensor modules, allowing for high bandwidth, link distance and cable flexibility.
"At FRAMOS, we take pride in providing our customers with the most advanced technologies on the market, bringing the best possible image into the memory of the customer's solution," said André Brela, Product Manager at FRAMOS. "We've invested in collaborating with Valens making the adopter module option with the VA7000 A-PHY chipset available to our joint customers because of the demand we see in the market for standardized long-reach CSI-2 extension, along with the innovations enabled by this technology, including cable length, EMC performance, and advanced link diagnostics."
D3 Embedded, a company specializing in embedded AI imaging solutions, is integrating the VA7000 chipsets into its camera modules, allowing for longer link distances and the use of simple, flexible cabling.
"We were impressed by Valens' ability to do multi-gig link speeds over unshielded cables and connectors," said Scott Reardon, CEO at D3 Embedded. "This is something our customers in the Industrial Vehicles and Robotics market have been looking for and it will open the door to more optimized embedded vision solutions. We're happy to be working with Valens to put this innovative product in front of our customers and partners."
Leopard Imaging, an established supplier of high-performance machine vision cameras, is offering an A-PHY camera module tailored for industrial applications.
"We're familiar with the technological advantages that Valens' A-PHY chipsets bring through our automotive module offering," said Cliff Cheng, SVP of Marketing at Leopard Imaging. "A-PHY solves issues we've had in providing high bandwidth, long distance connectivity will ensuring robust EMC immunity. We look forward to seeing these camera modules powering innovative, cross-market solutions."
The Valens' VA7000-based solutions by Teledyne e2v, Airy3D, FRAMOS, D3 Embedded and Leopard Imaging, as well as the Valens VS6320, will be showcased at the Valens booth (10F80) at VISION in Stuttgart, on October 8-10, 2024.
About Valens
Semiconductor
Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
Forward-Looking Statements
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Press Contacts
Yoni Dayan
Head of Communications
Valens Semiconductor Ltd.
Yoni.dayan@valens.com
Pat Burek
Senior Vice President
Financial Profiles, Inc.
pburek@finprofiles.com
Investor Contacts
Michal Ben Ari
Investor Relations Manager
Valens Semiconductor
michal.benari@valens.com
Lisa Fortuna
Senior Vice President
Financial Profiles, Inc.
lfortuna@finprofiles.com
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