Shaping Our Future with AI: DuPont Reveals Next-Generation Solutions at 2024 TPCA Show
DuPont is proud to collaborate with industry leaders for the session titled "Shaping Our Future with AI by
"Our new technology solutions highlight DuPont's commitment to innovation and collaboration with industry leaders in technologies that enable AI. As a powerhouse in advanced interconnect and thermal management solutions, we are dedicated to enhancing data computation and enabling data transfer speed and reliability, both of which are critical for AI functionalities. DuPont's session at the
The next-generation bump plating technologies, particularly DuPont™ Solderon™
Additionally, DuPont will unveil a novel seed layer method for glass substrates in advanced packaging that overcomes the limitations in via coverage and adhesion present in conventional techniques. By utilizing a polymer-based adhesion promoter, this innovative electroless copper process achieves complete via coverage and strong copper adhesion under low-temperature, production-friendly conditions. This advancement significantly enhances the viability of glass substrates for high-performance electronics in advanced packaging applications.
DuPont's participation in the TPCA Show highlights three pivotal themes: fine line technology, advanced packaging, and signal integrity & thermal management. Fine line patterns accelerate the integration of intricate circuits into compact spaces, enhancing overall efficiency and performance. Advanced packaging technologies optimize space utilization and support high-density interconnections, which are crucial for AI applications that require rapid data processing. Furthermore, maintaining signal integrity and implementing effective thermal management are essential for ensuring reliable functionality in high-performance computing environments.
At the show, DuPont experts will be present at the company's booth to share their extensive knowledge and insights on technological advancements and industry trends. Attendees will have the opportunity to explore DuPont's comprehensive solutions for AI applications.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, SM or ® are owned by affiliates of
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SOURCE DuPont