Equities
  • Price (EUR)52.18
  • Today's Change-0.52 / -0.99%
  • Shares traded99.00
  • 1 Year change+134.20%
  • Beta1.4709
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About the company

ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.

  • Revenue in USD (TTM)880.35m
  • Net income in USD117.11m
  • Incorporated2016
  • Employees2.02k
  • Location
    ACM Research Inc42307 Osgood Rd, Unit IFREMONT 94539United StatesUSA
  • Phone+1 (510) 445-3700
  • Fax+1 (510) 445-3708
  • Websitehttps://www.acmr.com/
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