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About the company
ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.
- Revenue in USD (TTM)880.35m
- Net income in USD117.11m
- Incorporated2016
- Employees2.02k
- LocationACM Research Inc42307 Osgood Rd, Unit IFREMONT 94539United StatesUSA
- Phone+1 (510) 445-3700
- Fax+1 (510) 445-3708
- Websitehttps://www.acmr.com/
